Senior Application Specialist

Challenge Yourself and Impact the Future!

 

Mac Dermid Alpha Electronics Solutions, a business of Element Solutions Inc (NYSE: ESI), is  renowned worldwide for its commitment to revolutionizing the electronics industry. With a legacy spanning over a century, we have continually set new benchmarks for excellence, reliability and sustainability in electronic materials.

 

Our Expertise:

 

Wafer Level Solutions - Revolutionizing wafer fabrication processes for enhanced efficiency and performance

 

Semiconductor Assembly Solutions - Driving innovation in semiconductor assembly processes for unparallelled reliability

 

Circuitry Solutions - Tailored solutions to meet the dynamic demands of modern circuitry

 

Circuit Board Assembly Solutions - Elevating circuit board assembly processes for optimal performance

 

Film & Smart Surface Solutions - Transforming electronics with cutting-edge materials and technologies for enhanced functionality and reliability

 

Across diverse sectors including automotive, consumer electronics, mobile devices, telecom, data storage, and infrastructure, Mac Dermid Alpha Electronics Solutions has earned the trust of manufacturers worldwide. Our comprehensive range of high quality solutions and technical services covers the entire electronics supply chain, empowering businesses to thrive in today's competitive landscape.

 

We strive to embody the five 'Elements of our Culture'- our '5 C's'; Challenge, Commit, Collaborate, Choose, and Care. These core values are the foundation of our organization which our employees embrace in their interactions with customers, colleagues and other stakeholders, to drive financial performance and create a rewarding work environment.

 
Who are we looking for?

Data Package Generation: Design and execute systematic studies to characterize new plating chemical systems, including process window mapping (Do E), bath life studies, and by-products tolerance testing.
POR Implementation: Author and deliver technical reports, SOPs, and "Best Known Methods" (BKMs) to facilitate the transition of chemistry from application testing to high volume manufacturing

Electrochemical Analysis: Lead the development of analytical control methods using CVS (Cyclic Voltammetric Stripping) , Hull Cell analysis, and potentiostatic techniques to ensure bath stability.
Customer Consultation: Act as a subject matter expert during technical reviews and troubleshooting sessions. Identify root causes for plating defects and lack of functional performance and provide corrective actions.

Metrology Leadership: Utilize SEM/EDX, XRF, X-section and 3 D profiler to characterize deposit properties such as morphology, grain structure, and thickness uniformity.
Who are You?

What competencies will you need?

Co-planarity & Profile Control: Optimize additive packages to achieve "Flat-top" pillar/RDL profiles and minimize Within-Die (WID) and Within-Wafer (WIW) height variation.
Feature Filling: Develop BKMs for void-free filling of Vias, Through-Silicon Vias (TSV) and high-aspect-ratio (HAR) features using multi-step current waveforms.
Alloy Control/Bumping: (For Sn Ag, Ni Fe, other) Manage bath stability to ensure consistent alloy composition across the wafer, critical for downstream reflow performance

Photoresist Compatibility: Validate chemistry performance with various dry-film and liquid photoresists, ensuring no undercut issues occur during the plating process.

Equal Opportunity Employer

 

All qualified applications will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, pregnancy, genetic information, disability, status as a protected veteran, or any other protected category applicable under federal, state and local laws.