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Asic/pmic Packaging – Principal Technical Program Manager, Zhubei City

Taiwan, 新竹縣, Zhubei City
發表 2024-06-11
過期 2024-06-11
ID #2189338259
Free
Asic/pmic Packaging – Principal Technical Program Manager, Zhubei City
Taiwan, 新竹縣, Zhubei City,
發表 June 11, 2024

描述

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR45164 ASIC/PMIC Packaging – Principal Technical Program Manager The ASIC Package Design Principal Technical Program Manager (TPM) is responsible for package assembly execution and qualification, from ASIC co-design start to ASIC qualification and release into high-volume-manufacturing.

The TPM has final approval of all risks associated with package design and assembly processing, and the TPM represents both package design and assembly process engineering in Product Development Team (PDT) meetings and Business Unit meetings. Responsibilities Maintain ASIC packaging roadmap Accountable for package technical requirements specifications for internal/external designed and ensuring customer specific requirements are captured and addressed Ownership of package technical requirements for design, assembly, and board level integration Support ASIC Design & System Architecture pathfinding activities with package design solution proposals and coordinate budgetary costing for solutions Collaborate with ASIC Package Design & ASIC assembly process engineering to maintain project schedules from feasibility through HVM release and reduce package risks Attend package NPI phase gate reviews & sign-off, work with internal engineering drive resolution of package design & assembly issues Drive business process improvements and work to close any systemic gaps with business partners Provide engineering recommendations to ASIC Design, Package Design, SIPI engineering, ASIC Quality Engineering, Foundry Engineering, Supply Chain/Procurement, and Assembly Process Engineering to ensure there is an appropriate balance between quality, performance, and cost Requirements The applicant should have a BS degree or higher in EE, ME, Mat E, Chem E, etc.

with 15+ years of relevant experience Flip chip assembly experience with CPI knowledge Assembly outsourcing management experience Experience with wafer bumping, fan-in, fan-out wafer level or panel level packaging is desirable Experience with and 3 D advanced packaging is a plus Good communication and presentation skills Able to work in a global environment across multiple time zones and countries Outsourcing experience with foundries, wafer bumping, probe, and/or test is a plus

職位詳情

工作類型: 全職
合同類型: 永恆的
薪酬類型: 每月
職業: Asic/pmic packaging – principal technical program manager

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