Key Responsibilities Develop new procedures and Best Known Methods (BKMs) to service new products Participate in or own first chamber Build & Test in Apps lab Solve issues, or work with Engineering to address issues identified Work with Manufacturing to develop procedures and participate (if required) on New Product final test Drive resolution of key issues with Engineering.

Own beta site test plans and reporting Partner with Quality & Reliability (Q&R) group to review and address Top Field Issues Participate in or own CAPA process Identify new parts that require to be stocked by AGS and work with them to ensure parts are stocked in correct locations Requirements Master's degree in Electronic Engineering, Mechanical Engineering, or Optoelectronics5+ years of working experience as HW leader, especially in Digital lithography Great communication skills in both Mandarin and English Can support 50% travel rate domestically and locally#Li Qualifications Education: Bachelor's Degree Skills: Certifications: Languages: Years of Experience:2 - 4 Years Work Experience: Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Yes, 50% of the Time Relocation Eligible: No