Job Description- Packaging Development Engineer for MEMS products- Package design and process development in co-operation with supplier and product engineering team for electronic sensors.- Developing solutions for assembly processes of MEMS for automotive and consumer application.- Coordination of sample manufacturing at assembly partner.- Team work in English language with a multitude of international interfaces is mandatory.

Qualifications- 3-8 Years experience in packaging/assembly of semiconductors components, especially familiar with LGA, BGA, and WLCSP packages- Preferred Solid technical background in assembly technology- Passion for developing technical solutions in multidisciplinary international projects- Experience in international corporation- Ability to travel- Very good English skills- Good team work with multitude of international interfaces