Job Description - Packaging Development Engineer for MEMS products - Package design and process development in co-operation with supplier and product engineering team for electronic sensors.

- Developing solutions for assembly processes of MEMS for automotive and consumer application.

- Coordination of sample manufacturing at assembly partner.

- Team work in English language with a multitude of international interfaces is mandatory.

Qualifications - 3-8 Years experience in packaging/assembly of semiconductors components, especially familiar with LGA, BGA, and WLCSP packages - Preferred Solid technical background in assembly technology - Passion for developing technical solutions in multidisciplinary international projects - Experience in international corporation - Ability to travel - Very good English skills - Good team work with multitude of international interfaces