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Tw_power Packages Development Engineer (power Module 研發), Taipei

發表 2024-07-05
過期 2024-08-05
ID #2226960371
Free
Tw_power Packages Development Engineer (power Module 研發), Taipei
Taiwan, 台北, 台北,
發表 July 5, 2024

描述

Job Description• Packaging Development Engineer for automotive power electronic products with focus on power modules for electrical drives• Package design and process development in co-operation with supplier and product engineering team.• Developing solutions for assembly processes for automotive application.• Coordination of sample manufacturing at assembly partner.• Teamwork in English language with a multitude of international interfaces is mandatory Qualifications• Experience in packaging/assembly of semiconductors including power semiconductors preferred• Solid technical background in assembly technology• Passion for developing technical solutions in multidisciplinary international projects• Very good English skills and experience in international cooperation• Ability to travel

職位詳情

工作類型: 全職
合同類型: 永恆的
薪酬類型: 每月
職業: Tw_power packages development engineer (power module 研發)

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