Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR54060 DEMQRA HBM EFA Engineer As a Global Quality (GQ) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer on the DRAM/Emerging Memory Quality and Reliability Assurance team (DEMQRA) at Micron Technology, Inc., we are responsible for the electrical characterization and EFA of all HBM product types.

We will need to distinguish its package related failures or device related.

We need to have DRAM functionality, process, test program and device knowledge to make the judgment.

We will also use a variety of test tools including the testers, Probers, CAD layout tools, and a couple of technical drawings and schematics to perform detailed characterization.

In this role we will communicate with various engineering groups, assist lab users with equipment setup and interpretation of data, and maintain an EFA database.

Responsibilities and Tasks Analyze Failed Components from Reliability Testing Interpret historical test results Adjust timing/level/testmode/code/temp to find out the sensitivities of failures for array fails Perform visual inspection to identify physical defects Schematics/layouts/process to recognize abnormalities Document failed conditions and test results Categorize electrical failures Identify and communicate new or unusual results (electrical signals)Respond to Equipment Issues Understand test configurations Identify and report issues Repair or coordinate repair of equipment Configure and upgrade test equipment Develop and deploy failure analysis (FA) software Provide Technical Support and Conduct Training Settle hardware setup and equipment / operator ratio Instruct operation of equipment Conduct on-the-job training (OJT) for new hires and transfers Provide data interpretation Suggest failure root cause Provide suggestions for further analysis Introduce new users to basic DRAM functionality/process/device Perform Engineering Requests and Supplemental Tasks Submit package level physical failure analysis (PFA)Provide FA for other groups as requested (RMA, Module)Resolve engineering test requirements Handle FA Information Build and maintain specific FA database Review FA data Identify false failures Analyze and summarize data Perform Quality/Reliability request and review Test time reduction requests Design/Marketing datasheet requests Modify Qual requests Material Review Board (MRB)Customer reports/data Education Bachelor/ Master's degree or equivalent experience Electrical Engineering, Electronics or related field of study Experience Experiences in each of the following: Failure Analysis Debugging (C Language, Python)Qualifications Good interpersonal skills and sharp attention to detail Excellent verbal and written communication skills Knowledge of the DRAM fabrication process/test program/functionality Familiarity with Unix, DFII/Cadence related testers such as ATE & u M3.

Ability to use the analytical tools provided on the various test equipment, such as Micromate, Curve Tracer, or Oscilloscope