Your Job
Own and integrate outsourced process modules at CM (contract manufacturing) testing house for silicon photonics chips, ensuring qualification readiness, process stability, yield/quality performance, and disciplined change control including wafer-level CP, dicing, laser marking, optical testing and AOI.
Our Team
- R&D-Component
What You Will Do Process integration ownership for assigned PIC in CM testing house: define/maintain process specs, key process parameters/limits, acceptance criteria, and qualification deliverables (focused on PIC critical features).
Cowork with sourcing and ME to lead process qualification and release readiness for outsourced steps (Electrical and optical testing, AOI): drive risk closure and ensure traceable qualification records.
Monitor yield/quality/SPC trends, identify excursions, and lead RCA/8 D with OSAT and internal teams; ensure corrective actions are validated and sustained.
Drive cross-module correlation (e.g., CP/AOI signals vs. wafer-level conditions) to accelerate root-cause isolation and improvement effectiveness.
Manage process change control (PCN/ECN-like): impact assessment, alignment, traceable release, and documentation discipline.
Coordinate cross-functionally within R&D (and Test/Quality as needed) to close issues and keep project timelines.
Who You Are (Basic Qualifications) BS/MS in EE/Optoelectronics/Physics/Materials/Chem E/ME or related fields.
2+ years in semiconductor manufacturing ecosystem, with experience in wafer-level process / wafer sort (CP) / AOI, or process integration/qualification for related modules.
Understanding of silicon photonics device sensitivity to process variations (e.g., optical performance/yield impact driven by critical dimensions, waveguide-related defects, contamination, alignment/inspection criteria).
Working knowledge of process control & problem-solving (SPC/CPK, RCA/8 D), and ability to translate findings into actionable CM instructions.
Data handling skills (Excel; JMP/Minitab/Python is a plus) and English communication for technical alignment with CM.
What Will Put You Ahead Experience supporting PIC/optical or mixed-signal product NPI and ramp, including cross-team debug with Test/Design.
Familiar with defect modes relevant to photonics (inspection criteria, pattern/edge/particle-type defects) and driving improvements with OSAT/AOI teams.
Experience with onsite CM engineering runs or supplier process reviews; comfortable driving qualification and change reviews with CM.
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