Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Micron seeks a Senior Engineer to innovate in Taiwan Taichung, developing groundbreaking wafer bonding and thinning processes.
Specific Responsibilities:
Assist in advanced package technology (chip stacking, or 3 D) research and developmentSupport project on-site execution and serve as a technical consultantTroubleshoot complex problems, perform root cause analysis, and resolve process engineering issuesDrive improvements in wafer bonding and wafer thinning performanceCoordinate experiments for technology development and yield improvementGenerate internal and external documentation for presentations and technical reportsQualifications:
Major in engineering science with experience in semiconductor processes, wafer bonding, and Si grinding technologiesProven innovative and independent thinking capabilitiesExceptionally motivated great teammateProficient in communication in both English and ChineseContribute to innovating information usage with significant impact on advanced packaging technologies.
