Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR47682 Package Characterization Engineer As a PDE Package Characterization Engineer you will be primarily responsible for defining, planning, and characterize new packages to improve product quality and reliability, working on second source and cost reduction, productivity improvement and risk management.

You will also be required to identify, diagnose, and resolve assembly process related problems by applying failure analysis, and some materials analysis methodology.

Additional responsibilities include coordinating and carrying out lab sourcing and material evaluation/optimization to assess reliability risks especially in those changes at assembly process step, leading and participating in cost reduction activities, handling new process baseline characterization, and liaising with material suppliers to achieve quality, cost and risk management objectives.

Responsibilities Collaborate with passives and solder paste material suppliers in meeting Micron materials specification and roadmaps.

Own overall material characterization planning and execution.

Collaborate with taskforce team on materials and package characterization.

Take the lead in driving resolution of issues encountered during package characterization.

Package characterization tracking and forecasting for new package NPIs, post reliability survivor analysis.

Be the Point-of Contact pertaining to all aspects of products/packages associated with passives and solder paste material.

Develop strategies to drive materials improvement.

Requirements MS above in Electronics/ Electrical/ Chemical/ Materials Engineering Experience in packaging materials, multi-layer ceramic capacitor, passives,or solder paste etc.

Experience in package failure analysis or materials characterization skills is an advantage.

Well-versed in semiconductor packaging process,materials, and reliability interaction Possess initiative and ability to work independently.

Good English skill in both oral and written.