Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR42814 Product Yield Enhancement (PYE) Engineer As a Product Yield Enhancement (PYE) Engineer for Micron Technology, Inc., you will work with a team responsible for taking next generation devices from design to mass production.

You will focus on failure analysis of test, internal qualification, and RMA failures, allowing for enhanced product reliability, rapid production ramp and early time to market.

Your primary areas of responsibility will utilize fault isolation with a combination of electrical and physical characterization techniques combined with data analysis to identify physical defects introduced by process level or assembly step.

Additionally, you will be responsible for communicating and coordinating failure analysis findings with Management, Product, Process, Assembly and Quality Assurance groups.

The general responsibilities of the position are the following: Perform Electrical Failure Analysis and Fault Isolation ​Operate u Mate bench test platform Operate Hamamatsu i PHEMOS, Thermo Fisher ELITE and other photon, thermal, or laser stimulating emission tools Characterize or model backend test, internal qualification, and RMA fail signatures Extensive understanding of physical and logical semi-conductor design Use layout/schematic to aid in fault isolation and fail signature modeling Understand various PFA and de-processing techniques for failures Understanding Fabrication Process and Package Assembly In depth understanding of CMOS process fabrication levels, steps, and methodologies Knowledge of the steps and details involved in the package assembly flow Understand reliability concerns that can cause delayed breakdown fail signatures Extensive expertise with process and assembly related defects as well as their causes and effects Provide Clear and Comprehensive Fail Signature Information Understand probe, backend test and qualification flows Generate organized and timely failure analysis reports with clearly communicated causes and effects Perform fab, probe, and backend data extractions to provide supplemental data Successful candidates for this position will have: Excellent problem-solving and analytical skills Strong grasp of concepts regarding thorough investigative procedure Computer aided layout and schematic experience Semiconductor process coursework and/or experience UNIX and Programming experience Experience working in teams and ability to work well with others Solid GPACourse work in VLSI design and semiconductor device physics (Preferred)Good communication skills Self-motivation and enthusiasm Education: Bachelor’s or higher Degree in Electrical or Computer Engineering